eHDF Platform compare with current 2.5D solution:

No through vias(TSVs, TLVs..) required.

No solders required between interposer / substrate / PCB.

One “super substrate” that can replace combined interposer and substrate.

Meet functional requirements and simplifies the manufacturing logistic.

Quick product prototyping.


SiPlus is developing system integration technologies and products that meet functional requirement with less impact to the environment.



SEMICON Taiwan 2019: Booth and Invited Talk

SiPlus had a booth in the “Heterogeneous Integration Innovation Zone” in Nangang Exhibition Hall Taipei, Taiwan during the period of SEMICON TW from Sep. 18 to 20, 2019. Dr. DC Hu, SEMI’s invited talk in TechXPOT to introduce the concept of “Integrated Substrate” and SiPlus heterogeneous integration platform solutions on Sep. 19, 2019.


2019 IMPACT Conference: Invited Talk

Dr. DC Hu, IMPACT’s invited talk on “Advance in Substrate Heterogeneous Integration Technology” in Nangang Exhibition Hall Taipei, Taiwan on Oct. 25, 2019.


NCAP’s China 2019 Forum: Table-top Show

SiPlus has a Table-top show in “Integrated Circuit Advanced Packaging Industry Chain Collaborative Innovation Development Forum” in Wuxi China on Nov. 21, 2019.

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