eHDF Platform compare with current 2.5D solution:
No through vias(TSVs, TLVs..) required.
No solders required between interposer / substrate / PCB.
One “super substrate” that can replace combined interposer and substrate.
Meet functional requirements and simplifies the manufacturing logistic.
Quick product prototyping.
SiPlus is developing system integration technologies and products that meet functional requirement with less impact to the environment.
DC Hu, Yole’s Invited talk “Substrate solutions for AI-HPC”, NCAP & Yole Development Symposium on Advanced Packaging & System Integration Technology on Shanghai, April 22, 2019
DC Hu, Invited talk, IMPACT Conference Taipei, Taiwan. October 2018
DC Hu, in IEEE International Interconnection Technology Conference, Santa Clara, CA. USA. September 2018