SiPlus was founded by Dr. Dyi-Chung Hu, a veteran in electronic packaging. The company was founded in 2014 and is in Taiwan National Tsing Hua University incubation center.
SiPlus can provide:
Thin film substrates:
- Thin film RDL on 12” glass. (RDL first)
- 2.2D thin film integrated substrate.
- SiPlus can support customer product/process development projects.
- 2.0D, 2.1D, 2.2D, 2.3D, and molded thin film RDL technology know-how and IP licensing.
- Please refer to “Work with SiPlus” for customer engagement.