ABOUT US

COMPANY PROFILE

SiPlus is developing system integration technologies and products that meet functional requirement with less impact to the environment.

By

  • 1Developing substrate integration structures that use less materials and process.
  • 2Developing Process and product that use less direct and indirect materials.
  • 3More efficient logistics.
  • 4Reduce overall product development cycle time.

HISTORY

  • 2014Company formed by Dr. DC Hu.
  • 2016First eHDF USP patent acquired.
  • 2018eHDF process verified by two MP partners.30+ USP patents acquired.

CORE TECHNOLOGY

eHDF Platform compare with current 2.5D solution:

  • 1No through vias (TSVs, TLVs..) required.
  • 2No solders required between interposer/substrate/PCB.
  • 3One “super substrate” that can replace combined interposer and substrate.
  • 4Meet functional requirements and simplifies the manufacturing logistic.
  • 5Quick product prototyping.
“eHDF”: embedded High Density Film
  • 101 Sec. 2 Kung Fu Rd, National Tsing Hua University, Incubation Center(South), Room 311, Hsinchu, Taiwan
  • TEL: 0916767301
  • EMAIL: eh.chen@si2plus.com