SiPlus was founded by Dr. Dyi-Chung Hu, a veteran in electronic packaging. The company was founded in 2014 and is in Taiwan National Tsing Hua University incubation center.

SiPlus can provide:

• Thin film substrates:
  • Thin film RDL on 12” glass. (RDL first)
  • 2.2D thin film integrated substrate.
• SiPlus can support customer product/process development projects.
• 2.0D, 2.1D, 2.2D, 2.3D, and molded thin film RDL technology know-how and IP licensing.
• Please refer to “Work with SiPlus” for customer engagement.