NCAP’s China 2019 Forum: Table-top Show

SiPlus has a Table-top show in “Integrated Circuit Advanced Packaging Industry Chain Collaborative Innovation Development Forum” in Wuxi China on Nov. 21, 2019.


2019 IMPACT Conference: Invited Talk

Dr. DC Hu, IMPACT’s invited talk on “Advance in Substrate Heterogeneous Integration Technology” in Nangang Exhibition Hall Taipei, Taiwan on Oct. 25, 2019.


SEMICON Taiwan 2019: Booth and Invited Talk

SiPlus had a booth in the “Heterogeneous Integration Innovation Zone” in Nangang Exhibition Hall Taipei, Taiwan during the period of SEMICON TW from Sep. 18 to 20, 2019. Dr. DC Hu, SEMI’s invited talk in TechXPOT to introduce the concept of “Integrated Substrate” and SiPlus heterogeneous integration platform solutions on Sep. 19, 2019.


Yole’s Invited Talk

DC Hu, Yole’s Invited talk “Substrate solutions for AI-HPC”, NCAP & Yole Development Symposium on Advanced Packaging & System Integration Technology on Shanghai, April 22, 2019


Electronic Packaging Solutions for Artificial Intelligence

DC Hu, Invited talk, IMPACT Conference Taipei, Taiwan. October 2018


An Innovative System Intergration Technology beyond BEOL

DC Hu, in IEEE International Interconnection Technology Conference, Santa Clara, CA. USA. September 2018

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